89HPES24T6G2ZBALG8
vs
89HPES24T6G2ZCALG8
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
FCBGA
|
FCBGA
|
Package Description |
FCBGA-324
|
FCBGA-324
|
Pin Count |
324
|
324
|
Manufacturer Package Code |
ALG324
|
ALG324
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.A.2
|
EAR99
|
HTS Code |
8542.31.00.01
|
8542.39.00.01
|
Address Bus Width |
|
|
Bus Compatibility |
PCI; SMBUS
|
PCI; SMBUS
|
Clock Frequency-Max |
100 MHz
|
100 MHz
|
External Data Bus Width |
|
|
JESD-30 Code |
S-PBGA-B324
|
S-PBGA-B324
|
JESD-609 Code |
e1
|
e1
|
Length |
19 mm
|
19 mm
|
Moisture Sensitivity Level |
4
|
4
|
Number of Terminals |
324
|
324
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA324,18X18,40
|
BGA324,18X18,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.42 mm
|
3.42 mm
|
Supply Voltage-Max |
1.1 V
|
1.1 V
|
Supply Voltage-Min |
0.9 V
|
0.9 V
|
Supply Voltage-Nom |
1 V
|
1 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
19 mm
|
19 mm
|
uPs/uCs/Peripheral ICs Type |
BUS CONTROLLER, PCI
|
BUS CONTROLLER, PCI
|
Base Number Matches |
1
|
1
|
|
|
|
Compare 89HPES24T6G2ZBALG8 with alternatives
Compare 89HPES24T6G2ZCALG8 with alternatives