8SLVD1208NBGI/W
vs
SY89874UMITR
feature comparison
| Pbfree Code |
Yes
|
No
|
| Part Life Cycle Code |
Not Recommended
|
Obsolete
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
MICREL INC
|
| Part Package Code |
VFQFPN
|
DFN
|
| Package Description |
HVQCCN,
|
HVQCCN, LCC16,.12SQ,20
|
| Pin Count |
28
|
16
|
| Manufacturer Package Code |
NBG28
|
MLF
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
18 Weeks
|
|
| Samacsys Manufacturer |
Renesas Electronics
|
|
| Family |
8SLVD
|
89874
|
| Input Conditioning |
DIFFERENTIAL MUX
|
DIFFERENTIAL
|
| JESD-30 Code |
S-XQCC-N28
|
S-XQCC-N16
|
| JESD-609 Code |
e3
|
e0
|
| Length |
5 mm
|
3 mm
|
| Logic IC Type |
LOW SKEW CLOCK DRIVER
|
LOW SKEW CLOCK DRIVER
|
| Moisture Sensitivity Level |
1
|
2
|
| Number of Functions |
1
|
1
|
| Number of Inverted Outputs |
|
|
| Number of Terminals |
28
|
16
|
| Number of True Outputs |
16
|
2
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
240
|
| Propagation Delay (tpd) |
0.38 ns
|
0.79 ns
|
| Same Edge Skew-Max (tskwd) |
0.04 ns
|
0.015 ns
|
| Seated Height-Max |
0.8 mm
|
0.95 mm
|
| Supply Voltage-Max (Vsup) |
2.625 V
|
2.625 V
|
| Supply Voltage-Min (Vsup) |
2.375 V
|
2.375 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
Tin/Lead (Sn85Pb15)
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
5 mm
|
3 mm
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
No
|
| Additional Feature |
|
CAN ALSO OPERATE WITH 3.3V SUPPLY
|
| Max Frequency@Nom-Sup |
|
2500000000 Hz
|
| Package Equivalence Code |
|
LCC16,.12SQ,20
|
| Packing Method |
|
TR
|
| Power Supply Current-Max (ICC) |
|
75 mA
|
| Qualification Status |
|
Not Qualified
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| fmax-Min |
|
2500 MHz
|
|
|
|
Compare 8SLVD1208NBGI/W with alternatives
Compare SY89874UMITR with alternatives