8X305/BUA
vs
8X305/BXA
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
PHILIPS COMPONENTS
|
NXP SEMICONDUCTORS
|
| Package Description |
,
|
DIP, DIP50,.9
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
NO
|
NO
|
| Address Bus Width |
8
|
8
|
| Bit Size |
8
|
8
|
| Clock Frequency-Max |
8 MHz
|
8 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
8
|
8
|
| JESD-30 Code |
S-CQCC-N68
|
R-CDIP-T50
|
| Number of I/O Lines |
|
|
| Number of Terminals |
68
|
50
|
| PWM Channels |
NO
|
NO
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Speed |
8 MHz
|
8 MHz
|
| Supply Voltage-Max |
5 V
|
5 V
|
| Supply Voltage-Min |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
| Terminal Position |
QUAD
|
DUAL
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
4
|
4
|
| ECCN Code |
|
3A001.A.2.C
|
| JESD-609 Code |
|
e0
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Package Code |
|
DIP
|
| Package Equivalence Code |
|
DIP50,.9
|
| Screening Level |
|
38535Q/M;38534H;883B
|
| Supply Voltage-Nom |
|
5 V
|
| Temperature Grade |
|
MILITARY
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
| Terminal Pitch |
|
2.54 mm
|
|
|
|
Compare 8X305/BUA with alternatives
Compare 8X305/BXA with alternatives