933669030652 vs 8403701CA feature comparison

933669030652 NXP Semiconductors

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8403701CA Motorola Mobility LLC

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Part Package Code DIP
Package Description DIP, ,
Pin Count 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDIP-T14
JESD-609 Code e4
Length 19.025 mm 8.89 mm
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 20
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code DIP
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE CHIP CARRIER
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT APPLICABLE
Propagation Delay (tpd) 190 ns 135 ns
Qualification Status Not Qualified
Seated Height-Max 4.2 mm 2.03 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT APPLICABLE
Width 7.62 mm 8.89 mm
Base Number Matches 1 5
Moisture Sensitivity Level NOT APPLICABLE

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