933706680602 vs MC74F02ND feature comparison

933706680602 NXP Semiconductors

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MC74F02ND Motorola Mobility LLC

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Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Part Package Code DIP DIP
Package Description DIP, DIP, DIP14,.3
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family F/FAST F/FAST
JESD-30 Code R-PDIP-T14 R-PDIP-T14
JESD-609 Code e4 e0
Length 19.025 mm 18.86 mm
Logic IC Type NOR GATE NOR GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 5.3 ns 5.3 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.2 mm 4.69 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm 7.62 mm
Base Number Matches 1 3
Load Capacitance (CL) 50 pF
Package Equivalence Code DIP14,.3
Power Supply Current-Max (ICC) 13 mA
Schmitt Trigger NO

Compare 933706680602 with alternatives

Compare MC74F02ND with alternatives