933835860025
vs
933713990652
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
DIE
SOIC
Package Description
DIE,
PLASTIC, SO-20
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HCT
HCT
JESD-30 Code
R-XUUC-N
R-PDSO-G20
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Number of Bits
8
8
Number of Functions
1
1
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
TRUE
TRUE
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
DIE
SOP
Package Equivalence Code
DIE OR CHIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
UNCASED CHIP
SMALL OUTLINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
NOT SPECIFIED
Propagation Delay (tpd)
48 ns
48 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Form
NO LEAD
GULL WING
Terminal Position
UPPER
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
fmax-Min
18 MHz
18 MHz
Base Number Matches
1
2
Pin Count
20
JESD-609 Code
e4
Length
12.8 mm
Moisture Sensitivity Level
1
Number of Terminals
20
Seated Height-Max
2.65 mm
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Pitch
1.27 mm
Width
7.5 mm
Compare 933835860025 with alternatives
Compare 933713990652 with alternatives