933835860025 vs 933713990652 feature comparison

933835860025 NXP Semiconductors

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933713990652 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code DIE SOIC
Package Description DIE, PLASTIC, SO-20
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HCT HCT
JESD-30 Code R-XUUC-N R-PDSO-G20
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 8 8
Number of Functions 1 1
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code DIE SOP
Package Equivalence Code DIE OR CHIP
Package Shape RECTANGULAR RECTANGULAR
Package Style UNCASED CHIP SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Propagation Delay (tpd) 48 ns 48 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Form NO LEAD GULL WING
Terminal Position UPPER DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Trigger Type POSITIVE EDGE POSITIVE EDGE
fmax-Min 18 MHz 18 MHz
Base Number Matches 1 2
Pin Count 20
JESD-609 Code e4
Length 12.8 mm
Moisture Sensitivity Level 1
Number of Terminals 20
Seated Height-Max 2.65 mm
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Pitch 1.27 mm
Width 7.5 mm

Compare 933835860025 with alternatives

Compare 933713990652 with alternatives