933975610602 vs NE555N feature comparison

933975610602 NXP Semiconductors

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NE555N Signetics

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS SIGNETICS CORP
Part Package Code SOIC
Package Description SOP, DIP-8
Pin Count 8
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type PULSE PULSE; RECTANGULAR
JESD-30 Code R-PDSO-G8 R-PDIP-T8
Length 4.9 mm
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Output Frequency-Max 0.5 MHz 0.5 MHz
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm
Supply Voltage-Max (Vsup) 16 V 16 V
Supply Voltage-Min (Vsup) 3 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS BIPOLAR
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 3.9 mm
Base Number Matches 1 2
JESD-609 Code e0
Package Equivalence Code DIP8,.3
Terminal Finish TIN LEAD

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