933975620602 vs ICM7555CBA feature comparison

933975620602 NXP Semiconductors

Buy Now Datasheet

ICM7555CBA Intersil Corporation

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS INTERSIL CORP
Part Package Code DIP SOIC
Package Description DIP, PLASTIC, SOIC-8
Pin Count 8 8
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type PULSE SQUARE
JESD-30 Code R-PDIP-T8 R-PDSO-G8
Length 9.5 mm 4.9 mm
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Output Frequency-Max 0.5 MHz 1 MHz
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.2 mm 1.75 mm
Supply Voltage-Max (Vsup) 16 V 18 V
Supply Voltage-Min (Vsup) 3 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm 3.9 mm
Base Number Matches 1 4
JESD-609 Code e0
Moisture Sensitivity Level 1
Package Equivalence Code SOP8,.25
Terminal Finish TIN LEAD

Compare 933975620602 with alternatives

Compare ICM7555CBA with alternatives