935279279157
vs
SC16IS760IPW,128
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Package Description |
HVQCCN,
|
4.40 MM, PLASTIC, MO-153, SOT355-1, TSSOP-24
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
CAN ALSO OPERATES AT 2.5 V SUPPLY
|
ALSO OPERATES AT 2.5V SUPPLY
|
| Address Bus Width |
2
|
2
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
80 MHz
|
80 MHz
|
| Communication Protocol |
ASYNC, BIT
|
ASYNC, BIT
|
| Data Encoding/Decoding Method |
NRZ
|
|
| Data Transfer Rate-Max |
0.625 MBps
|
0.625 MBps
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PQCC-N24
|
R-PDSO-G24
|
| JESD-609 Code |
e4
|
e4
|
| Length |
4 mm
|
7.8 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Serial I/Os |
1
|
1
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
TSSOP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Seated Height-Max |
1 mm
|
1.1 mm
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
4 mm
|
4.4 mm
|
| uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
TSSOP2
|
| Pin Count |
|
24
|
| Manufacturer Package Code |
|
SOT355-1
|
| Factory Lead Time |
|
52 Weeks
|
| Samacsys Manufacturer |
|
NXP
|
| Moisture Sensitivity Level |
|
1
|
| Package Equivalence Code |
|
TSSOP24,.25
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare 935279279157 with alternatives
Compare SC16IS760IPW,128 with alternatives