935282415132 vs TC7SZ17FU feature comparison

935282415132 NXP Semiconductors

Buy Now Datasheet

TC7SZ17FU Toshiba America Electronic Components

Buy Now Datasheet
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS TOSHIBA CORP
Package Description VSON, TSSOP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code S-PDSO-N6 R-PDSO-G5
JESD-609 Code e3
Length 1 mm 2 mm
Logic IC Type BUFFER BUFFER
Number of Functions 1 1
Number of Inputs 1 1
Number of Terminals 6 5
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSON TSSOP
Package Shape SQUARE RECTANGULAR
Package Style SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 14 ns 15.6 ns
Seated Height-Max 0.5 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 1.65 V
Supply Voltage-Nom (Vsup) 3 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish TIN
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.35 mm 0.65 mm
Terminal Position DUAL DUAL
Width 1 mm 1.25 mm
Base Number Matches 2 1
Rohs Code Yes
Part Package Code SSOP
Pin Count 5
Samacsys Manufacturer Toshiba
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Time@Peak Reflow Temperature-Max (s) 30

Compare TC7SZ17FU with alternatives