935311447557
vs
MCIMX536AVV8CR2
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
FREESCALE SEMICONDUCTOR INC
|
| Package Description |
,
|
19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, TEPBGA-529
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| JESD-609 Code |
e2
|
e2
|
| Moisture Sensitivity Level |
3
|
3
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Terminal Finish |
TIN SILVER
|
Tin/Silver (Sn/Ag)
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR CIRCUIT
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
1
|
2
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| ECCN Code |
|
5A002.A
|
| Samacsys Manufacturer |
|
NXP
|
| Address Bus Width |
|
26
|
| Bit Size |
|
32
|
| Boundary Scan |
|
YES
|
| Clock Frequency-Max |
|
27 MHz
|
| External Data Bus Width |
|
32
|
| Format |
|
FLOATING POINT
|
| Integrated Cache |
|
YES
|
| JESD-30 Code |
|
S-PBGA-B529
|
| Length |
|
19 mm
|
| Low Power Mode |
|
YES
|
| Number of Terminals |
|
529
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
HBGA
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
GRID ARRAY, HEAT SINK/SLUG
|
| Seated Height-Max |
|
1.85 mm
|
| Speed |
|
800 MHz
|
| Supply Voltage-Max |
|
1.15 V
|
| Supply Voltage-Min |
|
1.05 V
|
| Supply Voltage-Nom |
|
1.1 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
AUTOMOTIVE
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
0.8 mm
|
| Terminal Position |
|
BOTTOM
|
| Width |
|
19 mm
|
|
|
|
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