A3PN010-QNG48
vs
A3PN010-1QN48
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
6 X 6 MM, 0.90 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, QFN-48
|
6 X 6 MM, 0.90 HEIGHT, 0.40 MM PITCH, QFN-48
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
8 Weeks
|
|
| Samacsys Manufacturer |
Microchip
|
|
| JESD-30 Code |
S-XQCC-N48
|
S-XQCC-N48
|
| Length |
6 mm
|
6 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of Equivalent Gates |
10000
|
10000
|
| Number of Inputs |
34
|
|
| Number of Logic Cells |
260
|
|
| Number of Outputs |
34
|
|
| Number of Terminals |
48
|
48
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-20 °C
|
-20 °C
|
| Organization |
10000 GATES
|
260 CLBS, 10000 GATES
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
HQCCN
|
| Package Equivalence Code |
LCC48,.24SQ,16
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG
|
| Programmable Logic Type |
Field Programmable Gate Arrays
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
|
| Supply Voltage-Max |
1.575 V
|
1.575 V
|
| Supply Voltage-Min |
1.425 V
|
1.425 V
|
| Supply Voltage-Nom |
1.5 V
|
1.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.4 mm
|
0.4 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
6 mm
|
6 mm
|
| Base Number Matches |
4
|
2
|
| Number of CLBs |
|
260
|
| Peak Reflow Temperature (Cel) |
|
235
|
| Time@Peak Reflow Temperature-Max (s) |
|
20
|
|
|
|
Compare A3PN010-QNG48 with alternatives
Compare A3PN010-1QN48 with alternatives