A54SX16A-FFG256I vs A54SX16A-FG256 feature comparison

A54SX16A-FFG256I Microchip Technology Inc

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A54SX16A-FG256 Microsemi FPGA & SoC

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Rohs Code No No
Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI SOC PRODUCTS GROUP
Package Description 1 MM, FBGA-256 LBGA,
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01
Additional Feature 16000 TYPICAL GATES AVAILABLE 16000 TYPICAL GATES AVAILABLE
Combinatorial Delay of a CLB-Max 1.9 ns 1.4 ns
JESD-30 Code S-PBGA-B256 S-PBGA-B256
Length 17 mm 17 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1452 1452
Number of Equivalent Gates 24000 24000
Number of Inputs 180
Number of Logic Cells 1452
Number of Outputs 180
Number of Terminals 256 256
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 1452 CLBS, 24000 GATES 1452 CLBS, 24000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.68 mm 1.68 mm
Supply Voltage-Max 2.75 V 2.75 V
Supply Voltage-Min 2.25 V 2.25 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 17 mm 17 mm
Base Number Matches 3 2
Pbfree Code No
Part Package Code BGA
Pin Count 256
JESD-609 Code e0
Peak Reflow Temperature (Cel) 225
Terminal Finish TIN LEAD/TIN LEAD SILVER
Time@Peak Reflow Temperature-Max (s) 30

Compare A54SX16A-FFG256I with alternatives

Compare A54SX16A-FG256 with alternatives