A80960CA-33
vs
IBM26BL486DX2-V66GP
feature comparison
Part Life Cycle Code |
Obsolete
|
Contact Manufacturer
|
Ihs Manufacturer |
INTEL CORP
|
IBM MICROELECTRONICS
|
Part Package Code |
PGA
|
PGA
|
Package Description |
CERAMIC, PGA-168
|
PGA,
|
Pin Count |
168
|
168
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Additional Feature |
OPERATING CASE TEMPERATURE 0 TO 100 C
|
|
Address Bus Width |
32
|
32
|
Bit Size |
32
|
32
|
Boundary Scan |
NO
|
NO
|
Clock Frequency-Max |
66.66 MHz
|
33.33 MHz
|
External Data Bus Width |
32
|
32
|
Format |
FIXED POINT
|
FLOATING POINT
|
Integrated Cache |
NO
|
YES
|
JESD-30 Code |
S-CPGA-P168
|
S-CPGA-P168
|
Length |
44.7 mm
|
44.45 mm
|
Low Power Mode |
NO
|
YES
|
Number of DMA Channels |
4
|
|
Number of External Interrupts |
9
|
3
|
Number of Serial I/Os |
|
|
Number of Terminals |
168
|
168
|
On Chip Data RAM Width |
8
|
|
Operating Temperature-Max |
100 °C
|
85 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
PGA
|
PGA
|
Package Equivalence Code |
PGA168,17X17
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (words) |
512
|
0
|
Seated Height-Max |
4.57 mm
|
4.57 mm
|
Speed |
33 MHz
|
66 MHz
|
Supply Current-Max |
900 mA
|
850 mA
|
Supply Voltage-Max |
5.25 V
|
3.6 V
|
Supply Voltage-Min |
4.75 V
|
3 V
|
Supply Voltage-Nom |
5 V
|
3.3 V
|
Surface Mount |
NO
|
NO
|
Technology |
MOS
|
MOS
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Form |
PIN/PEG
|
PIN/PEG
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
PERPENDICULAR
|
PERPENDICULAR
|
Width |
44.7 mm
|
44.45 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR
|
Base Number Matches |
1
|
1
|
|
|
|
Compare A80960CA-33 with alternatives
Compare IBM26BL486DX2-V66GP with alternatives