AD9361BBCZ
vs
AD9361BBCZ-REEL
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
ANALOG DEVICES INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
CSPBGA-144
|
CSPBGA-144
|
| Pin Count |
144
|
144
|
| Manufacturer Package Code |
BC-144-7
|
BC-144-7
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
5A991.B
|
5A991.B
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Analog Devices
|
Analog Devices
|
| JESD-30 Code |
S-PBGA-B144
|
S-PBGA-B144
|
| JESD-609 Code |
e1
|
e1
|
| Length |
10 mm
|
10 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
144
|
144
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFBGA
|
LFBGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
1.7 mm
|
1.7 mm
|
| Supply Voltage-Nom |
1.3 V
|
1.3 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
RF AND BASEBAND CIRCUIT
|
RF AND BASEBAND CIRCUIT
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Width |
10 mm
|
10 mm
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare AD9361BBCZ with alternatives
Compare AD9361BBCZ-REEL with alternatives