ADCMP607BCPZ-R7
vs
ADCMP605BCPZ-WP
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
QFN
|
QFN
|
| Package Description |
3 X 3 MM, ROHS COMPLIANT, MO-220VEED-1, LFCSP-12
|
3 X 3 MM, ROHS COMPLIANT, MO-220VEED-1, LFCSP-12
|
| Pin Count |
12
|
12
|
| Reach Compliance Code |
unknown
|
unknown
|
| Amplifier Type |
COMPARATOR
|
COMPARATOR
|
| Average Bias Current-Max (IIB) |
5 µA
|
5 µA
|
| Input Offset Voltage-Max |
5000 µV
|
5000 µV
|
| JESD-30 Code |
S-XQCC-N12
|
S-XQCC-N12
|
| JESD-609 Code |
e3
|
e3
|
| Length |
3 mm
|
3 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
12
|
12
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
COMMERCIAL
|
COMMERCIAL
|
| Response Time-Nom |
2.1 ns
|
3 ns
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Supply Voltage Limit-Max |
6 V
|
6 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Width |
3 mm
|
3 mm
|
| Base Number Matches |
2
|
2
|
|
|
|