ADF7021-VBCPZ
vs
MAX2365EGM-D
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Not Recommended
|
Obsolete
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
QFN
|
|
| Package Description |
7 X 7 MM, ROHS COMPLAINT, MO-220VKKD-2, LFCSP-48
|
HVQCCN,
|
| Pin Count |
48
|
|
| Manufacturer Package Code |
CP-48-5
|
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Analog Devices
|
|
| JESD-30 Code |
S-XQCC-N48
|
S-XQCC-N48
|
| JESD-609 Code |
e3
|
e0
|
| Length |
7 mm
|
7 mm
|
| Moisture Sensitivity Level |
3
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
48
|
48
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Equivalence Code |
LCC48,.27SQ,20
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Supply Voltage-Nom |
3 V
|
2.8 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
RF AND BASEBAND CIRCUIT
|
RF AND BASEBAND CIRCUIT
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Matte Tin (Sn)
|
TIN LEAD
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
7 mm
|
7 mm
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare ADF7021-VBCPZ with alternatives
Compare MAX2365EGM-D with alternatives