ADG1413YCPZ-REEL
vs
HI1-0201/883
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
ROCHESTER ELECTRONICS INC
|
| Part Package Code |
QFN
|
|
| Package Description |
HVQCCN,
|
,
|
| Pin Count |
16
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| Additional Feature |
CAN ALSO OPERATES AT 12 V AND +/-15 V SUPPLY
|
|
| Analog IC - Other Type |
SPST
|
SPST
|
| JESD-30 Code |
S-XQCC-N16
|
R-GDIP-T16
|
| JESD-609 Code |
e3
|
|
| Length |
4 mm
|
|
| Moisture Sensitivity Level |
3
|
|
| Neg Supply Voltage-Max (Vsup) |
-16.5 V
|
|
| Neg Supply Voltage-Min (Vsup) |
-4.5 V
|
|
| Neg Supply Voltage-Nom (Vsup) |
-5 V
|
-15 V
|
| Number of Channels |
1
|
1
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
16
|
16
|
| Off-state Isolation-Nom |
80 dB
|
70 dB
|
| On-state Resistance Match-Nom |
0.13 Ω
|
|
| On-state Resistance-Max (Ron) |
5.4 Ω
|
70 Ω
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Package Body Material |
UNSPECIFIED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
HVQCCN
|
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
1 mm
|
|
| Supply Voltage-Max (Vsup) |
16.5 V
|
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
15 V
|
| Surface Mount |
YES
|
NO
|
| Switch-off Time-Max |
380 ns
|
500 ns
|
| Switch-on Time-Max |
510 ns
|
500 ns
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
MILITARY
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
| Terminal Pitch |
0.65 mm
|
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
4 mm
|
|
| Base Number Matches |
2
|
5
|
| Qualification Status |
|
MILITARY
|
|
|
|
Compare ADG1413YCPZ-REEL with alternatives
Compare HI1-0201/883 with alternatives