ADG407BPZ
vs
ADG507AKR-REEL
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
ANALOG DEVICES INC
|
| Part Package Code |
QLCC
|
SOIC
|
| Package Description |
PLASTIC, LCC-28
|
0.300 INCH, SOIC-28
|
| Pin Count |
28
|
28
|
| Manufacturer Package Code |
P-28
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Analog Devices
|
|
| Additional Feature |
CAN ALSO OPERATE WITH SINGLE 12V SUPPLY
|
|
| Analog IC - Other Type |
DIFFERENTIAL MULTIPLEXER
|
DIFFERENTIAL MULTIPLEXER
|
| JESD-30 Code |
S-PQCC-J28
|
R-PDSO-G28
|
| JESD-609 Code |
e3
|
e0
|
| Length |
11.505 mm
|
17.9 mm
|
| Moisture Sensitivity Level |
3
|
1
|
| Neg Supply Voltage-Max (Vsup) |
-16.5 V
|
-16.5 V
|
| Neg Supply Voltage-Min (Vsup) |
-13.5 V
|
-10.8 V
|
| Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
| Number of Channels |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
28
|
| Off-state Isolation-Nom |
75 dB
|
68 dB
|
| On-state Resistance Match-Nom |
4 Ω
|
22.5 Ω
|
| On-state Resistance-Max (Ron) |
80 Ω
|
450 Ω
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
SOP
|
| Package Equivalence Code |
LDCC28,.5SQ
|
SOP28,.4
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
240
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.57 mm
|
2.65 mm
|
| Signal Current-Max |
0.02 A
|
0.02 A
|
| Supply Current-Max (Isup) |
0.5 mA
|
1.5 mA
|
| Supply Voltage-Max (Vsup) |
16.5 V
|
16.5 V
|
| Supply Voltage-Min (Vsup) |
13.5 V
|
10.8 V
|
| Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
| Surface Mount |
YES
|
YES
|
| Switch-off Time-Max |
150 ns
|
300 ns
|
| Switch-on Time-Max |
150 ns
|
300 ns
|
| Switching |
BREAK-BEFORE-MAKE
|
BREAK-BEFORE-MAKE
|
| Technology |
BICMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
Tin/Lead (Sn85Pb15)
|
| Terminal Form |
J BEND
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
| Width |
11.505 mm
|
7.5 mm
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare ADG407BPZ with alternatives
Compare ADG507AKR-REEL with alternatives