ADG506ATE
vs
HI4-0506-8
feature comparison
| Part Life Cycle Code |
Contact Manufacturer
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
INTERSIL CORP
|
| Package Description |
HQCCN,
|
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SINGLE-ENDED MULTIPLEXER
|
SINGLE-ENDED MULTIPLEXER
|
| JESD-30 Code |
S-CQCC-N28
|
S-XQCC-N28
|
| Length |
11.43 mm
|
|
| Neg Supply Voltage-Max (Vsup) |
-16.5 V
|
|
| Neg Supply Voltage-Min (Vsup) |
-10.8 V
|
|
| Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
| Number of Channels |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
28
|
| Off-state Isolation-Nom |
68 dB
|
|
| On-state Resistance Match-Nom |
22.5 Ω
|
|
| On-state Resistance-Max (Ron) |
450 Ω
|
400 Ω
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC
|
| Package Code |
HQCCN
|
QCCN
|
| Package Equivalence Code |
LCC28,.45SQ
|
LCC28,.45SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG
|
CHIP CARRIER
|
| Seated Height-Max |
2.54 mm
|
|
| Supply Voltage-Max (Vsup) |
16.5 V
|
|
| Supply Voltage-Min (Vsup) |
10.8 V
|
|
| Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
| Surface Mount |
YES
|
YES
|
| Switch-off Time-Max |
300 ns
|
|
| Switch-on Time-Max |
300 ns
|
500 ns
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
11.43 mm
|
|
| Base Number Matches |
2
|
2
|
| Rohs Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Qualification Status |
|
Not Qualified
|
| Screening Level |
|
MIL-STD-883 Class B (Modified)
|
| Signal Current-Max |
|
0.02 A
|
| Supply Current-Max (Isup) |
|
3 mA
|
| Switching |
|
BREAK-BEFORE-MAKE
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|