ADG508ABQ
vs
MAX308EUE+
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Contact Manufacturer
|
Transferred
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
DIP
|
TSSOP
|
| Package Description |
DIP,
|
TSSOP-16
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
ALSO OPERATES WITH 10.8 V TO 16.5 V SINGLE SUPPLY
|
|
| Analog IC - Other Type |
SINGLE-ENDED MULTIPLEXER
|
SINGLE-ENDED MULTIPLEXER
|
| JESD-30 Code |
R-GDIP-T16
|
R-PDSO-G16
|
| JESD-609 Code |
e0
|
e3
|
| Length |
19.495 mm
|
5 mm
|
| Neg Supply Voltage-Max (Vsup) |
-16.5 V
|
-20 V
|
| Neg Supply Voltage-Min (Vsup) |
-10.8 V
|
-4.5 V
|
| Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
| Number of Channels |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Off-state Isolation-Nom |
68 dB
|
75 dB
|
| On-state Resistance Match-Nom |
22.5 Ω
|
1.5 Ω
|
| On-state Resistance-Max (Ron) |
450 Ω
|
100 Ω
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
TSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Seated Height-Max |
5.08 mm
|
1.1 mm
|
| Supply Voltage-Max (Vsup) |
16.5 V
|
20 V
|
| Supply Voltage-Min (Vsup) |
10.8 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
| Surface Mount |
NO
|
YES
|
| Switch-off Time-Max |
300 ns
|
150 ns
|
| Switch-on Time-Max |
300 ns
|
150 ns
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
MATTE TIN
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
4.4 mm
|
| Base Number Matches |
2
|
2
|
| ECCN Code |
|
EAR99
|
| Moisture Sensitivity Level |
|
1
|
| Package Equivalence Code |
|
TSSOP16,.25
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Signal Current-Max |
|
0.03 A
|
| Switching |
|
BREAK-BEFORE-MAKE
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare ADG508ABQ with alternatives
Compare MAX308EUE+ with alternatives