ADG509FBRNZ-REEL7
vs
ADG509FBRN-REEL7
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
ANALOG DEVICES INC
|
| Part Package Code |
SOIC
|
SOIC
|
| Package Description |
ROHS COMPLIANT, MS-012AC, SOIC-16
|
SOP, SOP16,.25
|
| Pin Count |
16
|
16
|
| Manufacturer Package Code |
R-16
|
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Analog Devices
|
|
| Additional Feature |
ACTIVE OVERVOLTAGE PROTECTION
|
ACTIVE OVERVOLTAGE PROTECTION
|
| Analog IC - Other Type |
DIFFERENTIAL MULTIPLEXER
|
DIFFERENTIAL MULTIPLEXER
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
| JESD-609 Code |
e3
|
e0
|
| Length |
9.9 mm
|
9.9 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Neg Supply Voltage-Max (Vsup) |
-16.5 V
|
-16.5 V
|
| Neg Supply Voltage-Min (Vsup) |
-13.5 V
|
-13.5 V
|
| Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
| Number of Channels |
4
|
4
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
16
|
16
|
| Off-state Isolation-Nom |
93 dB
|
93 dB
|
| On-state Resistance Match-Nom |
8.1 Ω
|
8.1 Ω
|
| On-state Resistance-Max (Ron) |
390 Ω
|
390 Ω
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Equivalence Code |
SOP16,.25
|
SOP16,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
240
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
1.75 mm
|
| Signal Current-Max |
0.02 A
|
0.02 A
|
| Supply Current-Max (Isup) |
0.2 mA
|
0.2 mA
|
| Supply Voltage-Max (Vsup) |
16.5 V
|
16.5 V
|
| Supply Voltage-Min (Vsup) |
13.5 V
|
13.5 V
|
| Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
| Surface Mount |
YES
|
YES
|
| Switch-off Time-Max |
150 ns
|
150 ns
|
| Switch-on Time-Max |
300 ns
|
300 ns
|
| Switching |
BREAK-BEFORE-MAKE
|
BREAK-BEFORE-MAKE
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
3.9 mm
|
3.9 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare ADG509FBRNZ-REEL7 with alternatives
Compare ADG509FBRN-REEL7 with alternatives