ADG619BRMZ
vs
ADG659YRQ
feature comparison
Pbfree Code |
No
|
No
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
ANALOG DEVICES INC
|
ANALOG DEVICES INC
|
Part Package Code |
TSSOP
|
SSOP
|
Package Description |
MSOP-8
|
MO-137AB, QSOP-16
|
Pin Count |
8
|
16
|
Manufacturer Package Code |
RM-8
|
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Analog Devices
|
|
Additional Feature |
ALSO OPERATE WITH 2.7V TO 5.5V SINGLE SUPPLY
|
ALSO OPERATE WITH 2 V TO 12 V
|
Analog IC - Other Type |
SPDT
|
DIFFERENTIAL MULTIPLEXER
|
JESD-30 Code |
S-PDSO-G8
|
R-PDSO-G16
|
JESD-609 Code |
e3
|
e0
|
Length |
3 mm
|
4.9022 mm
|
Moisture Sensitivity Level |
1
|
1
|
Neg Supply Voltage-Max (Vsup) |
-5.5 V
|
-6 V
|
Neg Supply Voltage-Min (Vsup) |
-2.7 V
|
-2 V
|
Neg Supply Voltage-Nom (Vsup) |
-5 V
|
-5 V
|
Normal Position |
NO
|
|
Number of Channels |
1
|
4
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
16
|
Off-state Isolation-Nom |
67 dB
|
90 dB
|
On-state Resistance Match-Nom |
0.7 Ω
|
1.3 Ω
|
On-state Resistance-Max (Ron) |
6.5 Ω
|
75 Ω
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output |
COMMON OUTPUT
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
SSOP
|
Package Equivalence Code |
TSSOP8,.19
|
SSOP16,.25
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
240
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.1 mm
|
1.7526 mm
|
Signal Current-Max |
0.05 A
|
0.02 A
|
Supply Current-Max (Isup) |
0.001 mA
|
0.001 mA
|
Supply Voltage-Max (Vsup) |
5.5 V
|
6 V
|
Supply Voltage-Min (Vsup) |
2.7 V
|
2 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Switch-off Time-Max |
75 ns
|
55 ns
|
Switch-on Time-Max |
120 ns
|
165 ns
|
Switching |
BREAK-BEFORE-MAKE
|
BREAK-BEFORE-MAKE
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
Terminal Finish |
Matte Tin (Sn) - annealed
|
TIN LEAD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.635 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
3 mm
|
3.9116 mm
|
Base Number Matches |
3
|
4
|
|
|
|
Compare ADG619BRMZ with alternatives
Compare ADG659YRQ with alternatives