ADG619BRMZ
vs
ADG752BRMZ
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
ROCHESTER ELECTRONICS INC
|
Part Package Code |
TSSOP
|
SOIC
|
Package Description |
TSSOP,
|
TSSOP,
|
Pin Count |
8
|
8
|
Reach Compliance Code |
unknown
|
unknown
|
Additional Feature |
ALSO OPERATE WITH 2.7V TO 5.5V SINGLE SUPPLY
|
CAN ALSO BE OPERATED FROM 4.5 TO 5.5V
|
Analog IC - Other Type |
SPDT
|
SPDT
|
JESD-30 Code |
S-PDSO-G8
|
S-PDSO-G8
|
JESD-609 Code |
e3
|
e3
|
Length |
3 mm
|
3 mm
|
Moisture Sensitivity Level |
1
|
1
|
Neg Supply Voltage-Max (Vsup) |
-5.5 V
|
|
Neg Supply Voltage-Min (Vsup) |
-2.7 V
|
|
Neg Supply Voltage-Nom (Vsup) |
-5 V
|
|
Number of Channels |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Off-state Isolation-Nom |
67 dB
|
80 dB
|
On-state Resistance Match-Nom |
0.7 Ω
|
0.2 Ω
|
On-state Resistance-Max (Ron) |
6.5 Ω
|
50 Ω
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
TSSOP
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Seated Height-Max |
1.1 mm
|
1.09 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2.7 V
|
1.8 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Switch-off Time-Max |
75 ns
|
8 ns
|
Switch-on Time-Max |
120 ns
|
18 ns
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
Width |
3 mm
|
3 mm
|
Base Number Matches |
2
|
2
|
Qualification Status |
|
COMMERCIAL
|
|
|
|
Compare ADG619BRMZ with alternatives
Compare ADG752BRMZ with alternatives