ADG759BCP
vs
ADG708BRU-REEL
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
ANALOG DEVICES INC
|
| Part Package Code |
QFN
|
TSSOP
|
| Package Description |
4 X 4 MM, CSP-20
|
TSSOP, TSSOP16,.25
|
| Pin Count |
20
|
16
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
ALSO OPERATE WITH 1.8V TO 5.5V SINGLE SUPPLY
|
ALSO OPERATE WITH 1.8V TO 5.5V SINGLE SUPPLY
|
| Analog IC - Other Type |
DIFFERENTIAL MULTIPLEXER
|
SINGLE-ENDED MULTIPLEXER
|
| JESD-30 Code |
S-XQCC-N20
|
R-PDSO-G16
|
| JESD-609 Code |
e0
|
e0
|
| Length |
4 mm
|
5 mm
|
| Moisture Sensitivity Level |
3
|
1
|
| Neg Supply Voltage-Max (Vsup) |
-2.75 V
|
-2.75 V
|
| Neg Supply Voltage-Min (Vsup) |
-2.25 V
|
-2.25 V
|
| Neg Supply Voltage-Nom (Vsup) |
-2.5 V
|
-2.5 V
|
| Number of Channels |
4
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
16
|
| Off-state Isolation-Nom |
60 dB
|
60 dB
|
| On-state Resistance Match-Nom |
0.4 Ω
|
0.4 Ω
|
| On-state Resistance-Max (Ron) |
4.5 Ω
|
4.5 Ω
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
TSSOP
|
| Package Equivalence Code |
LCC20,.16SQ,20
|
TSSOP16,.25
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
240
|
240
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.9 mm
|
1.2 mm
|
| Signal Current-Max |
0.03 A
|
0.03 A
|
| Supply Current-Max (Isup) |
0.001 mA
|
0.001 mA
|
| Supply Voltage-Max (Vsup) |
2.75 V
|
2.75 V
|
| Supply Voltage-Min (Vsup) |
2.25 V
|
2.25 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Switch-off Time-Max |
15 ns
|
15 ns
|
| Switch-on Time-Max |
25 ns
|
25 ns
|
| Switching |
BREAK-BEFORE-MAKE
|
BREAK-BEFORE-MAKE
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
4 mm
|
4.4 mm
|
| Base Number Matches |
6
|
2
|
| Pbfree Code |
|
No
|
| Manufacturer Package Code |
|
RU-16
|
| Output |
|
COMMON OUTPUT
|
|
|
|
Compare ADG759BCP with alternatives
Compare ADG708BRU-REEL with alternatives