ADG759BCP vs ADG820BRM feature comparison

ADG759BCP Analog Devices Inc

Buy Now Datasheet

ADG820BRM Rochester Electronics LLC

Buy Now Datasheet
Rohs Code No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer ANALOG DEVICES INC ROCHESTER ELECTRONICS INC
Part Package Code QFN SOIC
Package Description 4 X 4 MM, CSP-20 TSSOP,
Pin Count 20 8
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Additional Feature ALSO OPERATE WITH 1.8V TO 5.5V SINGLE SUPPLY
Analog IC - Other Type DIFFERENTIAL MULTIPLEXER SPDT
JESD-30 Code S-XQCC-N20 S-PDSO-G8
JESD-609 Code e0 e3
Length 4 mm 3 mm
Moisture Sensitivity Level 3 1
Neg Supply Voltage-Max (Vsup) -2.75 V
Neg Supply Voltage-Min (Vsup) -2.25 V
Neg Supply Voltage-Nom (Vsup) -2.5 V
Number of Channels 4 1
Number of Functions 1 1
Number of Terminals 20 8
Off-state Isolation-Nom 60 dB 71 dB
On-state Resistance Match-Nom 0.4 Ω 0.06 Ω
On-state Resistance-Max (Ron) 4.5 Ω 1.4 Ω
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code HVQCCN TSSOP
Package Equivalence Code LCC20,.16SQ,20
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 240 260
Qualification Status Not Qualified
Seated Height-Max 0.9 mm 1.09 mm
Signal Current-Max 0.03 A
Supply Current-Max (Isup) 0.001 mA
Supply Voltage-Max (Vsup) 2.75 V 5.5 V
Supply Voltage-Min (Vsup) 2.25 V 1.8 V
Supply Voltage-Nom (Vsup) 2.5 V 3 V
Surface Mount YES YES
Switch-off Time-Max 15 ns 45 ns
Switch-on Time-Max 25 ns 35 ns
Switching BREAK-BEFORE-MAKE
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish TIN LEAD MATTE TIN
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.5 mm 0.65 mm
Terminal Position QUAD DUAL
Width 4 mm 3 mm
Base Number Matches 2 2
Pbfree Code Yes
Time@Peak Reflow Temperature-Max (s) 40

Compare ADG759BCP with alternatives

Compare ADG820BRM with alternatives