ADG787BCBZ-REEL vs ADG787BCBZ-REEL feature comparison

ADG787BCBZ-REEL Analog Devices Inc

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ADG787BCBZ-REEL Rochester Electronics LLC

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Pbfree Code No Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer ANALOG DEVICES INC ROCHESTER ELECTRONICS INC
Part Package Code BGA BGA
Package Description LEAD FREE, WLCSP-10 VFBGA,
Pin Count 10 10
Manufacturer Package Code CB-10-1
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01
Samacsys Manufacturer Analog Devices
Analog IC - Other Type SPDT SPDT
JESD-30 Code R-XBGA-B10 R-XBGA-B10
JESD-609 Code e1 e1
Length 2 mm 2 mm
Moisture Sensitivity Level 1 1
Normal Position NO/NC
Number of Channels 1 1
Number of Functions 2 2
Number of Terminals 10 10
Off-state Isolation-Nom 63 dB 63 dB
On-state Resistance Match-Nom 0.07 Ω 0.07 Ω
On-state Resistance-Max (Ron) 5.75 Ω 5.75 Ω
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -25 °C
Output SEPARATE OUTPUT
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code VFBGA VFBGA
Package Equivalence Code BGA10,3X4,20
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified
Seated Height-Max 0.63 mm 0.63 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.8 V 1.8 V
Supply Voltage-Nom (Vsup) 2.7 V 2.7 V
Surface Mount YES YES
Switch-off Time-Max 6 ns 6 ns
Switch-on Time-Max 30 ns 30 ns
Switching BREAK-BEFORE-MAKE
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 40
Width 1.5 mm 1.5 mm
Base Number Matches 2 2