ADG819BCBZ-REEL
vs
ADG819BCB-REEL
feature comparison
Pbfree Code |
Yes
|
No
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
ANALOG DEVICES INC
|
ROCHESTER ELECTRONICS LLC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
VFBGA, BGA6,2X3,20
|
VFBGA,
|
Pin Count |
6
|
6
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
|
Analog IC - Other Type |
SPDT
|
SPDT
|
JESD-30 Code |
R-XBGA-B6
|
R-XBGA-B6
|
JESD-609 Code |
e1
|
e0
|
Length |
2.18 mm
|
2.18 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Channels |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
6
|
6
|
Off-state Isolation-Nom |
71 dB
|
71 dB
|
On-state Resistance Match-Nom |
0.06 Ω
|
0.06 Ω
|
On-state Resistance-Max (Ron) |
1.4 Ω
|
1.4 Ω
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
VFBGA
|
VFBGA
|
Package Equivalence Code |
BGA6,2X3,20
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
240
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
0.67 mm
|
0.67 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
1.8 V
|
1.8 V
|
Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Switch-off Time-Max |
16 ns
|
16 ns
|
Switch-on Time-Max |
60 ns
|
60 ns
|
Switching |
BREAK-BEFORE-MAKE
|
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
1.14 mm
|
1.14 mm
|
Base Number Matches |
1
|
2
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare ADG819BCBZ-REEL with alternatives
Compare ADG819BCB-REEL with alternatives