ADG819BRM-R2
vs
ADG784BCP-REEL7
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
SOIC
|
QFN
|
| Package Description |
TSSOP,
|
CSP-20
|
| Pin Count |
8
|
20
|
| Reach Compliance Code |
unknown
|
unknown
|
| Analog IC - Other Type |
SPDT
|
SINGLE-ENDED MULTIPLEXER
|
| JESD-30 Code |
S-PDSO-G8
|
S-XQCC-N20
|
| JESD-609 Code |
e0
|
e0
|
| Length |
3 mm
|
4 mm
|
| Moisture Sensitivity Level |
NOT SPECIFIED
|
3
|
| Number of Channels |
1
|
2
|
| Number of Functions |
1
|
4
|
| Number of Terminals |
8
|
20
|
| Off-state Isolation-Nom |
71 dB
|
65 dB
|
| On-state Resistance Match-Nom |
0.06 Ω
|
0.15 Ω
|
| On-state Resistance-Max (Ron) |
1.4 Ω
|
10 Ω
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
TSSOP
|
HVQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
240
|
| Seated Height-Max |
1.09 mm
|
0.9 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
3.3 V
|
| Supply Voltage-Min (Vsup) |
1.8 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Switch-off Time-Max |
16 ns
|
10 ns
|
| Switch-on Time-Max |
60 ns
|
25 ns
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
| Width |
3 mm
|
4 mm
|
| Base Number Matches |
2
|
2
|
| Additional Feature |
|
ALSO OPERATES AT 5V SUPPLY
|
| Qualification Status |
|
COMMERCIAL
|
|
|
|
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