ADM1066ACP
vs
ADM1066ACPZ-REEL7
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
ANALOG DEVICES INC
|
| Part Package Code |
QFN
|
QFN
|
| Package Description |
6 X 6 MM, MO-220VJJD-2, LFCSP-40
|
6 X 6 MM, LEAD FREE, MO-220VJJD-2, LFCSP-40
|
| Pin Count |
40
|
40
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Adjustable Threshold |
YES
|
YES
|
| Analog IC - Other Type |
POWER SUPPLY SUPPORT CIRCUIT
|
POWER SUPPLY SUPPORT CIRCUIT
|
| JESD-30 Code |
S-XQCC-N40
|
S-XQCC-N40
|
| JESD-609 Code |
e0
|
e3
|
| Length |
6 mm
|
6 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Channels |
10
|
10
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
40
|
40
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Equivalence Code |
LCC40,.24SQ,20
|
LCC40,.24SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
240
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Supply Voltage-Nom (Vsup) |
2.7 V
|
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
Matte Tin (Sn) - annealed
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
6 mm
|
6 mm
|
| Base Number Matches |
7
|
1
|
| Pbfree Code |
|
No
|
| Manufacturer Package Code |
|
CP-40-9
|
| Samacsys Manufacturer |
|
Analog Devices
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare ADM1066ACP with alternatives
Compare ADM1066ACPZ-REEL7 with alternatives