ADSP-21060CZZ-160
vs
ADSP-21060CWZ-133
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
ANALOG DEVICES INC
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
LEAD FREE, THERMALLY ENHANCED, HEAT SINK, CERAMIC, QFP-240
|
LEAD FREE, THERMALLY ENHANCED, METRIC, HEAT SINK, CERAMIC, QFP-240
|
| Pin Count |
240
|
240
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
32
|
32
|
| Barrel Shifter |
YES
|
YES
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
40 MHz
|
33.3 MHz
|
| External Data Bus Width |
48
|
48
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Internal Bus Architecture |
MULTIPLE
|
MULTIPLE
|
| JESD-30 Code |
S-CQFP-G240
|
S-CQFP-G240
|
| JESD-609 Code |
e1
|
e0
|
| Length |
32 mm
|
32 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
240
|
240
|
| Operating Temperature-Max |
100 °C
|
100 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
FQFP
|
FQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, FINE PITCH
|
FLATPACK, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.3 mm
|
4.2 mm
|
| Supply Voltage-Max |
5.25 V
|
5.25 V
|
| Supply Voltage-Min |
4.75 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD SILVER
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
32 mm
|
32 mm
|
| uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, OTHER
|
DIGITAL SIGNAL PROCESSOR, OTHER
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare ADSP-21060CZZ-160 with alternatives
Compare ADSP-21060CWZ-133 with alternatives