ADSP-21060LCB-133 vs ADSP-21060LAB-160 feature comparison

ADSP-21060LCB-133 Rochester Electronics LLC

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ADSP-21060LAB-160 Analog Devices Inc

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS INC ANALOG DEVICES INC
Part Package Code BGA BGA
Package Description BGA, PLASTIC, MS-034AAJ-2, BGA-225
Pin Count 225 225
Reach Compliance Code unknown not_compliant
Address Bus Width 32 32
Barrel Shifter YES YES
Boundary Scan YES YES
Clock Frequency-Max 33.33 MHz 40 MHz
External Data Bus Width 48 48
Format FLOATING POINT FLOATING POINT
Internal Bus Architecture MULTIPLE MULTIPLE
JESD-30 Code S-PBGA-B225 S-PBGA-B225
Length 23 mm 23 mm
Low Power Mode YES YES
Number of Terminals 225 225
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status COMMERCIAL Not Qualified
Seated Height-Max 2.7 mm 2.7 mm
Supply Voltage-Max 3.45 V 3.45 V
Supply Voltage-Min 3.15 V 3.15 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish NOT SPECIFIED TIN LEAD SILVER
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 23 mm 23 mm
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches 2 2
Pbfree Code No
Rohs Code No
Manufacturer Package Code B-225-2
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Bit Size 32
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Equivalence Code BGA225,15X15,50
Peak Reflow Temperature (Cel) 225
RAM (words) 131072
Supply Current-Max 600 mA
Temperature Grade INDUSTRIAL

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