ADSP-21062CS-160 vs ADSP-21062LKBZ-160 feature comparison

ADSP-21062CS-160 Rochester Electronics LLC

Buy Now Datasheet

ADSP-21062LKBZ-160 Analog Devices Inc

Buy Now Datasheet
Pbfree Code No No
Rohs Code No Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS INC ANALOG DEVICES INC
Part Package Code QFP BGA
Package Description HFQFP, ROHS COMPLIANT, PLASTIC, MS-034AAJ-2, BGA-225
Pin Count 240 225
Reach Compliance Code unknown unknown
Address Bus Width 32 32
Barrel Shifter YES YES
Boundary Scan YES YES
Clock Frequency-Max 40 MHz 40 MHz
External Data Bus Width 48 48
Format FLOATING POINT FLOATING POINT
Internal Bus Architecture MULTIPLE MULTIPLE
JESD-30 Code S-PQFP-G240 S-PBGA-B225
JESD-609 Code e0 e1
Length 32 mm 23 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of Terminals 240 225
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HFQFP BGA
Package Shape SQUARE SQUARE
Package Style FLATPACK, HEAT SINK/SLUG, FINE PITCH GRID ARRAY
Peak Reflow Temperature (Cel) 225 260
Qualification Status COMMERCIAL Not Qualified
Seated Height-Max 4.1 mm 2.7 mm
Supply Voltage-Max 5.25 V 3.45 V
Supply Voltage-Min 4.75 V 3.15 V
Supply Voltage-Nom 5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form GULL WING BALL
Terminal Pitch 0.5 mm 1.27 mm
Terminal Position QUAD BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 32 mm 23 mm
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches 2 1
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Bit Size 32
Operating Temperature-Max 85 °C
Operating Temperature-Min
Package Equivalence Code BGA225,15X15,50
RAM (words) 2097152
Temperature Grade OTHER

Compare ADSP-21062LKBZ-160 with alternatives