ADSP-21062LKSZ-160
vs
ADSP-21062LABZ-160
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
ROCHESTER ELECTRONICS INC
|
| Part Package Code |
QFP
|
BGA
|
| Package Description |
ROHS COMPLIANT, MS-029GA, MQFP-240
|
BGA,
|
| Pin Count |
240
|
225
|
| Reach Compliance Code |
unknown
|
unknown
|
| Address Bus Width |
32
|
32
|
| Barrel Shifter |
YES
|
YES
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
40 MHz
|
40 MHz
|
| External Data Bus Width |
48
|
48
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Internal Bus Architecture |
MULTIPLE
|
MULTIPLE
|
| JESD-30 Code |
S-PQFP-G240
|
S-PBGA-B225
|
| JESD-609 Code |
e3
|
e1
|
| Length |
32 mm
|
23 mm
|
| Low Power Mode |
YES
|
YES
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Terminals |
240
|
225
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HFQFP
|
BGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, HEAT SINK/SLUG, FINE PITCH
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
COMMERCIAL
|
COMMERCIAL
|
| Seated Height-Max |
4.1 mm
|
2.7 mm
|
| Supply Voltage-Max |
3.45 V
|
3.45 V
|
| Supply Voltage-Min |
3.15 V
|
3.15 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
TIN SILVER COPPER
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.5 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
NOT SPECIFIED
|
| Width |
32 mm
|
23 mm
|
| uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, OTHER
|
DIGITAL SIGNAL PROCESSOR, OTHER
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare ADSP-21062LABZ-160 with alternatives