ADSP-BF533SBBC400 vs ADSP-BF533SBB500 feature comparison

ADSP-BF533SBBC400 Analog Devices Inc

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ADSP-BF533SBB500 Rochester Electronics LLC

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer ANALOG DEVICES INC ROCHESTER ELECTRONICS INC
Part Package Code BGA BGA
Package Description 12 X 12 MM, 1.70 MM HEIGHT, MO-205AE, CSPBGA-160 BGA,
Pin Count 160 169
Manufacturer Package Code BC-160-2
Reach Compliance Code unknown unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Additional Feature ALSO REQUIRES 3V OR 3.3V SUPPLY ALSO REQUIRES 3V OR 3.3V SUPPLY
Address Bus Width 20 19
Barrel Shifter YES YES
Bit Size 32
Boundary Scan YES YES
Clock Frequency-Max 40 MHz 40 MHz
External Data Bus Width 16 16
Format FIXED POINT FIXED POINT
Internal Bus Architecture MULTIPLE MULTIPLE
JESD-30 Code S-PBGA-B160 S-PBGA-B169
JESD-609 Code e0 e0
Length 12 mm 19 mm
Low Power Mode YES YES
Number of Terminals 160 169
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA BGA
Package Equivalence Code BGA160,14X14,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY
Qualification Status Not Qualified COMMERCIAL
Seated Height-Max 1.7 mm 2.5 mm
Speed 400 MHz
Supply Voltage-Max 1.32 V 1.45 V
Supply Voltage-Min 0.8 V 0.8 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD SILVER TIN LEAD SILVER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 12 mm 19 mm
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches 1 2
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30

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