ADSP-BF533SBBCZ500
vs
ADSP-BF533SBBZ500
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
ROCHESTER ELECTRONICS INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
LFBGA,
|
BGA,
|
Pin Count |
160
|
169
|
Reach Compliance Code |
unknown
|
unknown
|
Additional Feature |
ALSO REQUIRES 3V OR 3.3V SUPPLY
|
ALSO REQUIRES 3V OR 3.3V SUPPLY
|
Address Bus Width |
19
|
19
|
Barrel Shifter |
YES
|
YES
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
40 MHz
|
40 MHz
|
External Data Bus Width |
16
|
16
|
Format |
FIXED POINT
|
FIXED POINT
|
Internal Bus Architecture |
MULTIPLE
|
MULTIPLE
|
JESD-30 Code |
S-PBGA-B160
|
S-PBGA-B169
|
JESD-609 Code |
e1
|
e1
|
Length |
12 mm
|
19 mm
|
Low Power Mode |
YES
|
YES
|
Moisture Sensitivity Level |
3
|
3
|
Number of Terminals |
160
|
169
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
BGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
COMMERCIAL
|
COMMERCIAL
|
Seated Height-Max |
1.7 mm
|
2.5 mm
|
Supply Voltage-Max |
1.45 V
|
1.45 V
|
Supply Voltage-Min |
0.8 V
|
0.8 V
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
Width |
12 mm
|
19 mm
|
uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, OTHER
|
DIGITAL SIGNAL PROCESSOR, OTHER
|
Base Number Matches |
2
|
2
|
|
|
|