ADSP-BF533SBBZ400
vs
ADSP-BF533SBST400
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
ROCHESTER ELECTRONICS INC
|
| Part Package Code |
BGA
|
QFP
|
| Package Description |
BGA,
|
LFQFP,
|
| Pin Count |
169
|
176
|
| Reach Compliance Code |
unknown
|
unknown
|
| Additional Feature |
ALSO REQUIRES 3V OR 3.3V SUPPLY
|
ALSO REQUIRES 3V OR 3.3V SUPPLY
|
| Address Bus Width |
19
|
20
|
| Barrel Shifter |
YES
|
YES
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
40 MHz
|
40 MHz
|
| External Data Bus Width |
16
|
16
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Internal Bus Architecture |
MULTIPLE
|
MULTIPLE
|
| JESD-30 Code |
S-PBGA-B169
|
S-PQFP-G176
|
| JESD-609 Code |
e1
|
|
| Length |
19 mm
|
24 mm
|
| Low Power Mode |
YES
|
YES
|
| Moisture Sensitivity Level |
NOT SPECIFIED
|
1
|
| Number of Terminals |
169
|
176
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
LFQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
225
|
| Qualification Status |
COMMERCIAL
|
COMMERCIAL
|
| Seated Height-Max |
2.5 mm
|
1.6 mm
|
| Supply Voltage-Max |
1.45 V
|
1.32 V
|
| Supply Voltage-Min |
0.8 V
|
0.8 V
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
NOT SPECIFIED
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
1 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
30
|
| Width |
19 mm
|
24 mm
|
| uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, OTHER
|
DIGITAL SIGNAL PROCESSOR, OTHER
|
| Base Number Matches |
2
|
2
|
|
|
|