ADSP-BF533SBSTZ400 vs ADSP-BF533SBB500 feature comparison

ADSP-BF533SBSTZ400 Analog Devices Inc

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ADSP-BF533SBB500 Rochester Electronics LLC

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Pbfree Code No No
Rohs Code Yes No
Part Life Cycle Code Active Active
Ihs Manufacturer ANALOG DEVICES INC ROCHESTER ELECTRONICS INC
Part Package Code QFP BGA
Package Description LFQFP, QFP176,1.0SQ,20 BGA,
Pin Count 176 169
Manufacturer Package Code ST-176
Reach Compliance Code compliant unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Samacsys Manufacturer Analog Devices
Additional Feature ALSO REQUIRES 3V OR 3.3V SUPPLY ALSO REQUIRES 3V OR 3.3V SUPPLY
Address Bus Width 19 19
Barrel Shifter YES YES
Bit Size 32
Boundary Scan YES YES
Clock Frequency-Max 40 MHz 40 MHz
External Data Bus Width 16 16
Format FIXED POINT FIXED POINT
Internal Bus Architecture MULTIPLE MULTIPLE
JESD-30 Code S-PQFP-G176 S-PBGA-B169
JESD-609 Code e3 e0
Length 24 mm 19 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of Terminals 176 169
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP BGA
Package Equivalence Code QFP176,1.0SQ,20
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH GRID ARRAY
Peak Reflow Temperature (Cel) 260 225
Qualification Status Not Qualified COMMERCIAL
Seated Height-Max 1.6 mm 2.5 mm
Speed 400 MHz
Supply Voltage-Max 1.45 V 1.45 V
Supply Voltage-Min 0.8 V 0.8 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Matte Tin (Sn) - annealed TIN LEAD SILVER
Terminal Form GULL WING BALL
Terminal Pitch 0.5 mm 1 mm
Terminal Position QUAD BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 24 mm 19 mm
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches 1 2

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