ADSP-BF533SKBC600
vs
ADSP-BF533SKBCZ600
feature comparison
Pbfree Code |
No
|
Yes
|
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
ROCHESTER ELECTRONICS INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
LFBGA,
|
LFBGA,
|
Pin Count |
160
|
160
|
Reach Compliance Code |
unknown
|
unknown
|
Additional Feature |
ALSO REQUIRES 2.5V OR 3.3V SUPPLY
|
ALSO REQUIRES 2.5V OR 3.3V SUPPLY
|
Address Bus Width |
20
|
20
|
Barrel Shifter |
YES
|
YES
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
50 MHz
|
50 MHz
|
External Data Bus Width |
16
|
16
|
Format |
FIXED POINT
|
FIXED POINT
|
Internal Bus Architecture |
MULTIPLE
|
MULTIPLE
|
JESD-30 Code |
S-PBGA-B160
|
S-PBGA-B160
|
JESD-609 Code |
e0
|
e1
|
Length |
12 mm
|
12 mm
|
Low Power Mode |
YES
|
YES
|
Moisture Sensitivity Level |
NOT SPECIFIED
|
3
|
Number of Terminals |
160
|
160
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
LFBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
220
|
260
|
Qualification Status |
COMMERCIAL
|
COMMERCIAL
|
Seated Height-Max |
1.7 mm
|
1.7 mm
|
Supply Voltage-Max |
1.32 V
|
1.32 V
|
Supply Voltage-Min |
0.8 V
|
0.8 V
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD SILVER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
Width |
12 mm
|
12 mm
|
uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, OTHER
|
DIGITAL SIGNAL PROCESSOR, OTHER
|
Base Number Matches |
2
|
2
|
|
|
|