ADSP-BF535PKBZ-300
vs
ADSP-BF535PKB-300
feature comparison
Pbfree Code |
No
|
No
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ANALOG DEVICES INC
|
ANALOG DEVICES INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
LEAD FREE, PLASTIC, MS-034AAG-1, BGA-260
|
BGA-260
|
Pin Count |
260
|
260
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
26
|
26
|
Barrel Shifter |
YES
|
YES
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
40 MHz
|
40 MHz
|
External Data Bus Width |
32
|
32
|
Format |
FIXED POINT
|
FIXED POINT
|
Internal Bus Architecture |
MULTIPLE
|
MULTIPLE
|
JESD-30 Code |
S-PBGA-B260
|
S-PBGA-B260
|
JESD-609 Code |
e1
|
e0
|
Length |
19 mm
|
19 mm
|
Low Power Mode |
YES
|
YES
|
Moisture Sensitivity Level |
3
|
3
|
Number of Terminals |
260
|
260
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.5 mm
|
2.5 mm
|
Supply Voltage-Max |
1.575 V
|
1.575 V
|
Supply Voltage-Min |
0.95 V
|
0.95 V
|
Supply Voltage-Nom |
1.5 V
|
1.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD SILVER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
19 mm
|
19 mm
|
uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, OTHER
|
DIGITAL SIGNAL PROCESSOR, OTHER
|
Base Number Matches |
1
|
1
|
Bit Size |
|
32
|
Package Equivalence Code |
|
BGA260,18X18,40
|
Speed |
|
300 MHz
|
|
|
|