ADUC812BCP
vs
ADUC812BSZ
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
ROCHESTER ELECTRONICS INC
|
| Part Package Code |
QFN
|
QFP
|
| Package Description |
LEAD FRAME, CSP-56
|
QFP,
|
| Pin Count |
56
|
52
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
24
|
24
|
| Bit Size |
8
|
8
|
| Clock Frequency-Max |
11.0592 MHz
|
11.0592 MHz
|
| DAC Channels |
YES
|
YES
|
| DMA Channels |
YES
|
YES
|
| External Data Bus Width |
8
|
8
|
| JESD-30 Code |
S-PQCC-N56
|
S-PQFP-G52
|
| JESD-609 Code |
e0
|
e3
|
| Length |
8 mm
|
10 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of I/O Lines |
32
|
32
|
| Number of Terminals |
56
|
52
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
NO
|
NO
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VQCCN
|
QFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, VERY THIN PROFILE
|
FLATPACK
|
| Peak Reflow Temperature (Cel) |
240
|
260
|
| Qualification Status |
Not Qualified
|
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
1 mm
|
2.45 mm
|
| Speed |
11.0592 MHz
|
11.0592 MHz
|
| Supply Voltage-Max |
3.3 V
|
3.3 V
|
| Supply Voltage-Min |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
MATTE TIN
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
8 mm
|
10 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
2
|
2
|
| Pbfree Code |
|
Yes
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare ADUC812BCP with alternatives
Compare ADUC812BSZ with alternatives