ADV7181CBSTZ-REEL
vs
ADV7180BSTZ
feature comparison
| Pbfree Code |
No
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
ROCHESTER ELECTRONICS INC
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
10 X 10MM, ROHS COMPLIANT, MS-026BCD, LQFP-64
|
LFQFP,
|
| Pin Count |
64
|
64
|
| Manufacturer Package Code |
ST-64-2
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Samacsys Manufacturer |
Analog Devices
|
|
| Consumer IC Type |
COLOR SIGNAL DECODER
|
COLOR SIGNAL DECODER
|
| JESD-30 Code |
S-PQFP-G64
|
S-PQFP-G64
|
| JESD-609 Code |
e3
|
e3
|
| Length |
10 mm
|
10 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
64
|
64
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFQFP
|
LFQFP
|
| Package Equivalence Code |
QFP64,.47SQ,20
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
COMMERCIAL
|
| Seated Height-Max |
1.6 mm
|
1.6 mm
|
| Supply Voltage-Max (Vsup) |
3.45 V
|
2 V
|
| Supply Voltage-Min (Vsup) |
3.15 V
|
1.65 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
40
|
| Width |
10 mm
|
10 mm
|
| Base Number Matches |
1
|
2
|
| Additional Feature |
|
IT ALSO REQUIRES 1.65V TO 2V SUPPLY
|
| Technology |
|
CMOS
|
|
|
|
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