AGL1000V2-CSG281 vs M1AGL250V2-FGG144 feature comparison

AGL1000V2-CSG281 Microsemi Corporation (now Microchip)

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M1AGL250V2-FGG144 Microchip Technology Inc

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Package Description Tfbga, Bga281,19x19,20 Lbga, Bga144,12x12,40
Reach Compliance Code Compliant Compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 108 Mhz 108 Mhz
JESD-30 Code S-PBGA-B281 S-PBGA-B144
Length 10 Mm 13 Mm
Moisture Sensitivity Level 3 3
Number of CLBs 24576
Number of Equivalent Gates 1000000 250000
Number of Terminals 281 144
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 24576 Clbs, 1000000 Gates 6144 Clbs, 250000 Gates
Package Body Material Plastic/Epoxy Plastic/Epoxy
Package Code TFBGA LBGA
Package Equivalence Code BGA281,19X19,20 BGA144,12X12,40
Package Shape Square Square
Package Style Grid Array, Thin Profile, Fine Pitch Grid Array, Low Profile
Peak Reflow Temperature (Cel) 260 260
Programmable Logic Type Field Programmable Gate Array Field Programmable Gate Array
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.05 Mm 1.55 Mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount Yes Yes
Technology Cmos Cmos
Temperature Grade Other Other
Terminal Form Ball Ball
Terminal Pitch 0.5 Mm 1 Mm
Terminal Position Bottom Bottom
Time@Peak Reflow Temperature-Max (s) 30 30
Width 10 Mm 13 Mm
Base Number Matches 3 3
Pin Count 144
Manufacturer Package Code LFBGA-144
Factory Lead Time 12 Weeks
JESD-609 Code e1
Number of Inputs 97
Number of Logic Cells 6144
Number of Outputs 97
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)