AGL1000V2-FGG144
vs
AGLN015V2-QNG68I
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, FBGA-144
|
8 X 8 MM, 0.90 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, QFN-68
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
8 Weeks
|
8 Weeks
|
JESD-30 Code |
S-PBGA-B144
|
S-XQCC-N68
|
JESD-609 Code |
e1
|
|
Length |
13 mm
|
8 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Equivalent Gates |
1000000
|
15000
|
Number of Inputs |
97
|
|
Number of Logic Cells |
24576
|
|
Number of Outputs |
97
|
|
Number of Terminals |
144
|
68
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
1000000 GATES
|
384 CLBS, 15000 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
LBGA
|
HVQCCN
|
Package Equivalence Code |
BGA144,12X12,40
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.55 mm
|
1 mm
|
Supply Voltage-Max |
1.575 V
|
1.575 V
|
Supply Voltage-Min |
1.14 V
|
1.14 V
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
|
Terminal Form |
BALL
|
NO LEAD
|
Terminal Pitch |
1 mm
|
0.4 mm
|
Terminal Position |
BOTTOM
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
13 mm
|
8 mm
|
Base Number Matches |
9
|
1
|
Number of CLBs |
|
384
|
|
|
|
Compare AGL1000V2-FGG144 with alternatives
Compare AGLN015V2-QNG68I with alternatives