AGL125V5-CS196
vs
AGL125V5-CS196I
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
8 X 8 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, CSP-196
|
8 X 8 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, CSP-196
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
8 Weeks
|
|
| Samacsys Manufacturer |
Microchip
|
Microchip
|
| JESD-30 Code |
S-PBGA-B196
|
S-PBGA-B196
|
| Length |
8 mm
|
8 mm
|
| Number of Equivalent Gates |
125000
|
125000
|
| Number of Inputs |
133
|
133
|
| Number of Logic Cells |
3072
|
3072
|
| Number of Outputs |
133
|
133
|
| Number of Terminals |
196
|
196
|
| Operating Temperature-Max |
85 °C
|
100 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
125000 GATES
|
125000 GATES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFBGA
|
TFBGA
|
| Package Equivalence Code |
BGA196,14X14,20
|
BGA196,14X14,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Supply Voltage-Max |
1.575 V
|
1.575 V
|
| Supply Voltage-Min |
1.425 V
|
1.425 V
|
| Supply Voltage-Nom |
1.5 V
|
1.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Width |
8 mm
|
8 mm
|
| Base Number Matches |
4
|
1
|
|
|
|
Compare AGL125V5-CS196 with alternatives
Compare AGL125V5-CS196I with alternatives