AGLP125V5-CS281I vs AGLP125V5-CS281 feature comparison

AGLP125V5-CS281I Microsemi FPGA & SoC

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AGLP125V5-CS281 Microchip Technology Inc

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICROSEMI SOC PRODUCTS GROUP MICROCHIP TECHNOLOGY INC
Part Package Code BGA
Package Description TFBGA, BGA281,19X19,20 10 X 10 MM, 1.05 MM HEIGHT, 0.5 MM PITCH, CSP-281
Pin Count 281
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 250 MHz 250 MHz
JESD-30 Code S-PBGA-B281 S-PBGA-B281
Length 10 mm 10 mm
Number of CLBs 3120 3120
Number of Equivalent Gates 125000 125000
Number of Inputs 212 212
Number of Logic Cells 3120 3120
Number of Outputs 212 212
Number of Terminals 281 281
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 3120 CLBS, 125000 GATES 3120 CLBS, 125000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Equivalence Code BGA281,19X19,20 BGA281,19X19,20
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.05 mm 1.05 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 10 mm 10 mm
Base Number Matches 1 4
Packing Method TRAY

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Compare AGLP125V5-CS281 with alternatives