AK4673EG
vs
MAX98091ETM+
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
ASAHI KASEI MICRODEVICES CORP
|
|
| Part Package Code |
BGA
|
48-LFCSP-6X6X0.75
|
| Package Description |
VFBGA,
|
|
| Pin Count |
57
|
48
|
| Reach Compliance Code |
unknown
|
|
| HTS Code |
8542.39.00.01
|
|
| Filter |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B57
|
S-XQCC-N48
|
| JESD-609 Code |
e1
|
e3
|
| Length |
5 mm
|
6 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
57
|
48
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-30 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
VFBGA
|
HVQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1 mm
|
0.8 mm
|
| Supply Voltage-Nom |
3.3 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
PCM CODEC
|
PCM CODEC
|
| Temperature Grade |
OTHER
|
|
| Terminal Finish |
TIN SILVER COPPER
|
Matte Tin (Sn)
|
| Terminal Form |
BALL
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.4 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Width |
5 mm
|
6 mm
|
| Base Number Matches |
1
|
2
|
| Rohs Code |
|
Yes
|
| Manufacturer Package Code |
|
48-LFCSP-6X6X0.75
|
| Date Of Intro |
|
2013-06-14
|
| Samacsys Manufacturer |
|
Analog Devices
|
| Input Code |
|
TWOS COMPLEMENT
|
| Input Type |
|
SINGLE-ENDED/DIFF
|
| Moisture Sensitivity Level |
|
1
|
| Number of Channels |
|
6
|
| Output |
|
VOLTAGE
|
| Output Code |
|
TWOS COMPLEMENT
|
| Package Equivalence Code |
|
LCC48,.24SQ,16
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Technology |
|
CMOS
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare AK4673EG with alternatives
Compare MAX98091ETM+ with alternatives