AM2147-55DC vs NMC2147HJ-3L feature comparison

AM2147-55DC AMD

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NMC2147HJ-3L National Semiconductor Corporation

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC NATIONAL SEMICONDUCTOR CORP
Part Package Code DIP
Package Description CERAMIC, DIP-18 DIP, DIP18,.3
Pin Count 18
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 55 ns 55 ns
Additional Feature AUTOMATIC POWER-DOWN
I/O Type SEPARATE SEPARATE
JESD-30 Code R-GDIP-T18 R-GDIP-T18
JESD-609 Code e0 e0
Length 22.86 mm
Memory Density 4096 bit 4096 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 1 1
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 18 18
Number of Words 4096 words 4096 words
Number of Words Code 4000 4000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 4KX1 4KX1
Output Characteristics 3-STATE 3-STATE
Output Enable NO NO
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP18,.3 DIP18,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.08 mm
Standby Voltage-Min 4.5 V 4.5 V
Supply Current-Max 0.18 mA 0.125 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology NMOS NMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 3 1

Compare AM2147-55DC with alternatives

Compare NMC2147HJ-3L with alternatives