AM26LS32BIN vs DS26LS32MJ/883 feature comparison

AM26LS32BIN NXP Semiconductors

Buy Now Datasheet

DS26LS32MJ/883 Rochester Electronics LLC

Buy Now Datasheet
Part Life Cycle Code Obsolete Contact Manufacturer
Ihs Manufacturer NXP SEMICONDUCTORS ROCHESTER ELECTRONICS LLC
Part Package Code DIP DIP
Package Description DIP, CERAMIC, DIP-16
Pin Count 16 16
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Input Characteristics DIFFERENTIAL SCHMITT TRIGGER DIFFERENTIAL SCHMITT TRIGGER
Interface IC Type LINE RECEIVER LINE RECEIVER
Interface Standard V.10; V.11; EIA-422; EIA-423; FED STD 1020; FED STD 1030 EIA-422; EIA-423; FED STD 1020; FED STD 1030
JESD-30 Code R-PDIP-T16 R-GDIP-T16
Length 19.025 mm 19.43 mm
Number of Functions 4 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Receive Delay-Max 26 ns 25 ns
Receiver Number of Bits 4 4
Seated Height-Max 4.2 mm 5.08 mm
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR TTL
Temperature Grade INDUSTRIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 2
Pbfree Code No
Rohs Code No
Driver Number of Bits 4
Moisture Sensitivity Level 1
Output Low Current-Max 0.008 A
Package Equivalence Code DIP16,.3
Peak Reflow Temperature (Cel) NOT SPECIFIED
Screening Level MIL-STD-883
Supply Current-Max 70 mA
Supply Voltage-Max 5.5 V
Supply Voltage-Min 4.5 V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare AM26LS32BIN with alternatives

Compare DS26LS32MJ/883 with alternatives