AM27C256-200DCB
vs
TC57256AD-20
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
TOSHIBA CORP
|
| Reach Compliance Code |
compliant
|
unknown
|
| Base Number Matches |
4
|
1
|
| Pbfree Code |
|
No
|
| Rohs Code |
|
No
|
| Part Package Code |
|
DIP
|
| Package Description |
|
0.600 INCH, WINDOWED, CERDIP-28
|
| Pin Count |
|
28
|
| Access Time-Max |
|
200 ns
|
| JESD-30 Code |
|
R-GDIP-T28
|
| JESD-609 Code |
|
e0
|
| Length |
|
36.83 mm
|
| Memory Density |
|
262144 bit
|
| Memory IC Type |
|
UVPROM
|
| Memory Width |
|
8
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
28
|
| Number of Words |
|
32768 words
|
| Number of Words Code |
|
32000
|
| Operating Mode |
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
|
32KX8
|
| Output Characteristics |
|
3-STATE
|
| Package Body Material |
|
CERAMIC, GLASS-SEALED
|
| Package Code |
|
WDIP
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
IN-LINE, WINDOW
|
| Parallel/Serial |
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
6 mm
|
| Supply Voltage-Max (Vsup) |
|
5.25 V
|
| Supply Voltage-Min (Vsup) |
|
4.75 V
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Surface Mount |
|
NO
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
TIN LEAD
|
| Terminal Form |
|
THROUGH-HOLE
|
| Terminal Pitch |
|
2.54 mm
|
| Terminal Position |
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Width |
|
15.24 mm
|
|
|
|
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